Back in Singapore
after a few days in Kuala Lumpur
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| KL Skyline | 
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| Petaling Street KL | 
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| Guan Di Temple KL | 
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Guan Di Temple KL 
   Singapore Skyline from Top of Ion Orchard 
 
 
A few more
thoughts on reliability issues for MEMS (Micro Electro Mechanical Systems).  
  
 
Stiction 
 
 
Why is it such a HUGE problem? 
 
  
 
- Forces
attracting the surfaces > forces pulling them apart (spring forces)
 
- In the
macro world not a big problem but in the micro world it is
 
- Surface
area scales with dimensions squared but volume and mass scale with dimension
cubed
 
 
 
  |  
| Elephants Don't Climb Walls |  
 
 
Forces that
attract surfaces: 
 
- Capillary
forces (Long range micrometres, moist environment, rough surfaces) 
 
 
  
 
- Electrostatic
forces  (Long range, micrometres, dry environment smooth or rough surfaces)
 
- Hydrogen
bridging  (Close range, OH terminated
smooth surfaces in a dry environment)
 
- Van der Waal’s
forces  (Short range,  smooth surface close together in a dry
environment, hydrophobic )
 
 
 
 
 
  
 
What can be done about it? 
  
- For capillary induced stiction reducing the relative humidity can help
if the packaging allows it. Not always possible
 
- Minimise surface contact area:
 
- For bending cantilevers, try to have an arc shape rather than and
"s" shape to minimise surface area of contact.
 
 
 
 
 
  
  
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Minimise area of ContactImage based on http://www.me.unm.edu/~zleseman/news/news.htm 
 
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- Create
surface roughness or dimples on contact surfaces
 
 
  
 
  
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Three-mask process for cantilever:  
(a) mask I, dimples in oxide  
(b) mask 2, anchor in oxide 
 
(c) structural poly deposition and mask 3, poly pattern  
(d) sacrificial oxide layer etching 
From:Introduction to Microfabrication, Sami Franssil, John Wiley, 2010 
- Coat surfaces with low surface energy materials such as diamond like carbon (DLC),
Self Assembly Monolayers (SAMs) 
 
 
 
  
  
  
  
From::
Vapor-Phase Self-Assembled Monolayers for 
 
Anti-Stiction
Applications in MEMS, Yan Xin Zhuang et al 
Journal Of
Microelectromechanical Systems, 16(6), pp1451-1460, 2007 
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