Monday 26 September 2016

RF Package Technology : Principles, Issues and Challenges in Penang

Weekend in Penang

 
Penang Street Food

Penang Street Food

Penang Street Food

More Street Food in Love Lane


Just completed Day 1 of the course on RF Package Technology : Principles, Issues and Challenges

What sort of substrates should we be using for RF packages? There are plenty to choose from. Here  are some comparisons:



Technology
For
Against
Thin Film Ceramics
Wide range of substrate materials. Excellent line tolerance of ± 2.5 mm. Smooth high conductivity metals Traditional for high end mm wave applications. Circuits up to 100GHz
Hermetic
Expensive. Limited no of layers. Limited resistor ranges
Thick-Film Ceramics 
Wide range of substrate materials. Many decades of laser trimmed resistors  Hermetic. Lower cost than thin film
Poorer line tolerance ± 25 mm compared to thin film. Higher resistivity and roughness of metal layers. Limited no of layers
High Temperature Co-fired Ceramic (HTCC)
More layers than thick or thin film. Hermetic. Cheaper in volume production.
Shrinkage issues. Limited range of substrates.  Higher resistivity of metal layers. High tooling costs
Low Temperature Co-fired Ceramic (LTCC)
Better conductivity metal lines than HTCC. More layers than thick or thin film. Hermetic. Cheaper in volume production.
Shrinkage issues. Limited range of substrates. High tooling costs
Polymer Laminate
Low Cost. Standard SMT technology. Wide range of low permittivity substrates. Supports many metal layers. High conductivity smooth copper traces.
Poor linewidth tolerance ± 50 mm. Poor thermal conductivity. Not hermetic. Limited temperature range.

Just looking at ceramic substrates there are several to choose from:

Substrate
Applications
Properties
Alumina eg  99.6 %
Low to medium power  RF & microwave circuits
Permittivity=9.8
 Low cost  smooth, polished surface for fine lines 25 mm or better
Wide range of applications. Widely available
Quartz (SiO2)
Microwave & millimeter-wave circuits requiring extremely low loss or low
CTE
Permittivity=3.8.
Smooth, polished surface for fine lines 25 mm or better. Low loss tangent
Aluminium Nitride (AlN)
High-power RF & Microwave circuits using Silicon or GaAs ICs.  Optimal CTE match with Silicon devices
Permittivity=8.9 
Good thermal conductivity. Good TCE match to Si. Surface finish not as good as alumina or quartz
Beryllia (BeO)
High-power RF & Microwave circuits
Permittivity=6.7
Excellent thermal conductivity. Surface finish not as good as alumina or quartz. Dust is toxic.



Plymer laminates are popular due to low cots but the most widely sued, FR4 has some shortcoming at high frequency



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